Diamond Wire Online Cleaning System
What Is Diamond Wire Online Cleaning System
The cleaning system employs a patented structural design that creates dynamic cleaning zones on both sides of the wire mesh. By utilizing the cavitation effect generated by high-frequency ultrasonic vibrations, it continuously cleans the high-speed moving wire mesh, ensuring the diamond wire remains clean and the diamond particles are not clogged. This improves the cutting conditions, reduces the breakage rate, extends the diamond wire's lifespan, and enhances processing quality. High power density and uniform sound field distribution; supports multi-frequency mode, resulting in high cleaning efficiency and no blind zone.
Advantages of Diamond Wire Online Cleaning System
High Efficiency And Quality
Only clean, well-maintained diamond wire online cleaning systems produce precise cuts (e.G., silicon wafers, semiconductors, minerals and stones) ans provide high efficiency and quality. Ultrasonic inline diamond wire online cleaning system saw cleaning is the superior technique to clean diamond wire online cleaning system saws in a continuous inline process thereby ensuring permanently fresh cleaned diamond wire online cleaning systems for optimum cutting performance.
Prevents Defects And Damage Of The Cut Material
Furthermore, only a clean sawing or cutting diamond wire online cleaning system prevents defects and damage of the cut material. Ultrasonic cleaning using high-performance, low-frequency ultrasound waves, which cause intense turbulences and acoustic cavitation, has been established as a highly reliable technique for the continuous cleaning of endless materials.
Ensures High Efficiency
The cutting or sawing diamond wire online cleaning system is guided along the ultrasound transmitting sonotrode in very close proximity thereby passing through the intense cavitation hot zone. The high amplitudes and the focused sonication via ultrasonic sonotrode ensures high efficiency and excels ultrasonic cleaning tanks by far. The cavitational hot zone beneath the sonotrode is characterized by intense turbulences, shear stress, high pressures and temperatures and respective differentials as well as liquid jets.
Why Choose Us
Our Factory
The company has assembled top industry technical talents along with seasoned marketing and management professionals. Leveraging cutting-edge proprietary core technologies, it specializes in researching, developing, and selling high-performance power ultrasonic core components and related complete sets of equipment. With around 2000 square meters of research and production facilities, the company possesses a well-equipped testing center capable of conducting more than 120 types of tests in six categories.
Our Certificate
National high-tech enterprise; GB/T19001-2016/ISO9001:2015 quality management system certification; 23 patents and 3 software copyrights granted.
Production equipment
Three-axis machining center, CNC lathe, high-temperature aging furnace, ultrasonic component analyzer, high-precision oscilloscope, power analyzer, cavitation intensity measurement instrument, spectrum analyzer, laser particle size analyzer, digital bridge, infrared thermal imaging instrument, microscope, laser vibrometer, etc.
Production market
The company's products are widely used in various industries such as new materials, fine chemicals, automotive, and new energy. Since its establishment, it has achieved cumulative sales of over 45 million RMB.
Clean wire surfaces are important when it comes to wire saws and diamond wire saws. Only clean, well-maintained wires produce precise cuts (e.G., silicon wafers, semiconductors, minerals and stones) ans provide high efficiency and quality. Ultrasonic inline wire saw cleaning is the superior technique to clean wire saws in a continuous inline process thereby ensuring permanently fresh cleaned wires for optimum cutting performance. Cleaning sawing and cutting wires with ultrasound during the production of semiconductor boards and silicon wafers as well as for cutting applications in other industries, wire saws and cutting wires are widely used to cut the wafers into thin plates. These sawing and cutting wires (e.G., diamond wire saws, grain wire saws) must be well maintained and kept free from contamination in order to obtained the desired cutting precision and efficiency. Furthermore, only a clean sawing or cutting wire prevents defects and damage of the cut material. Ultrasonic cleaning using high-performance, low-frequency ultrasound waves, which cause intense turbulences and acoustic cavitation, has been established as a highly reliable technique for the continuous cleaning of endless materials. Ultrasonics’ wire saw cleaning technology applies focused ultrasound via a special designed sonotrode (ultrasonic probe or horn) in a continuous process into a water bath. The cutting or sawing wire is guided along the ultrasound transmitting sonotrode in very close proximity thereby passing through the intense cavitation hot zone. The high amplitudes and the focused sonication via ultrasonic sonotrode ensures high efficiency and excels ultrasonic cleaning tanks by far. The cavitational hot zone beneath the sonotrode is characterized by intense turbulences, shear stress, high pressures and temperatures and respective differentials as well as liquid jets. These intense forces remove dust, dirt and contaminating particles from the cutting wires and disperse them in the water bath, where the particles get flushed away.
Improved cleaning of wire saws and cutting wires with ultrasonic cleaning technology provides substantial improvements to industries that use wire saws (e.G., diamond wire cutting) – including wafer cutting in the semiconductor and photovoltaic industry. By ultrasonic cavitation, any cutting wires such as diamond-impregnated wires are cleaned very efficiently. On the on hand, cleaner cutting wires results in cleaner cuts. Thereby a higher product quality and lower reject rates during production are achieved. On the other hand, the intensively cleaned wire is capable to be operated at higher cutting frequency, which allows for faster cutting and a more efficient system utilization as well as higher levels of production efficiency. In the photovoltaic and semiconductor industry, for wafer cutting mainly diamond wires are used due to their high cutting capability and efficiency as well as for its abrasion resistance. Cutting materials such as silicon wafers (e.G. Monocrystalline silicon) is a mechanical separation process, which causes friction and heat. Due to the friction and material wear, particles such as dust and debris remain on the surface of the cutting wire. Such contamination can result in in-precise cuts, surface damage and defects. Ultrasound is well known for its capabilities in the cleaning of metal parts.
Diamond Wire Online Cleaning System Takes You into the Working Principle of Diamond Wire Saw
Diamond wire saws provide the most accurate cutting with the least amount of material deformation and chipping of material. Today diamond wire sawing is preferred by majority of solar silicon manufacturers, crystal growers, advanced ceramic manufacturers over other technologies/ cutting methods. Diamond wire saw operates similarly to horizontal hack saw, where head containing a pack of blades lengths of plain edge stainless or spring steel mounted parallel to head travel oscillates back and forth over the work piece or pieces which are mounted on a bed. The bed can be fed up into the blades at selected pressures. The diamond wire provides cutting or lapping action between the blades and material. The wire saw allows slicing of hundreds of wafers simultaneously with the same continuous wire. In the past abrasives slurry wire saws were the main method used for cutting these ultra hard and brittle materials. Copper plated piano wires was used to trap abrasive particles (such as alumina or sic) suspended in mechanical oil or water based coolant. To provide the cutting action and lubrication of the moving wire. The wire diameter used was smaller than 0.15mm and cutting kerf is about 0.19mm and 0.15mm and smaller.
Abrasive slurry grit ranged from 1000 to 250 grit. Viscosity and continuous mixing of the slurry must be maintained in order to produces consistent results. The improvement in diamond wire manufacturing technology and reduction in cost has made diamond wire cutting and industry standard. Diamond wire bonded with diamond offers many advantages in terms of faster cutting speed (frequently triple the speed) and improved surface finish quality (less secondary operations such as polishing). Using diamond wire is much cleaner and faster process today most diamond wire is wound around 2, 3,or 4 grooved mandrels in order to allow multiple loops for simultaneous slicing of the same ingot. When the looped wire is running across the ingot, the diamond particles on the surface of the wire will slowly lap/ grind off silicon on micro level (bit by bit). The cutting action is done by reciprocating motion. The wire is used once, and replaced with a new roll.
Typically this type of wire saw can travel at surface speed of 6 mm/sec. The wire moves forward for abut 300mm and this is retraced for abut 200mm. Net advance of the new wire is at an average speed of 2 m/sec with about 100 m new wire passed through each cycle. The wire can run continuously for more than 300 km long. More than 500 slices can be sawn simultaneously. In a production environment 8” (200mm) silicon boul can be cut in less than 8 hours and 12” (300mm) boul in less than 12 hours.
Diamond Wire Online Cleaning System Operation with Cleaning and Maintenance After Sawing
Step 1
Effective starting of the wire saw is important if you want to ensure the success of your operations. For starters, close the valve on reduction pressure block by counter-clockwise rotation of the knob. When it stops, go for 2 turns back. Now you can start your hydraulic unit. Set to maximum, the feeding flow related to the unit. In order to achieve this you need to turn the controls present on the related remote control in the clockwise direction. Now you need to create wire tension through careful knob turning on the reduction pressure block in the clockwise direction. Continue with it until you find that the tension in the wire is sufficient. Seating of the wire should be correct on every individual wheel for ensuring an effective operational start to the wire sawing process.
Step 2
Now the next step is starting the rotation of the motor and for this, you need to turn controls associated with motor rotation present on the remote control in the clockwise direction. Gradually increase the speed of the motor by turning associated controls for generating motor rotation. You should be quite careful regarding the process because this is one of the crucial factors determining smooth wire saw operations. An effective working pressure is generated when cutting pressure falls between 100 bar to 130 bar. This depends upon a number of wheel sets used in the magazine coupled with the amount of wire used along with the hardness of the material you want to cut with the wire saw. However, during this process it is important to heed a special WARNING! For effective cooling of the wire during cutting, it is important to consider the best cooling water position via adjustment in relation to the material ready to be cut. It is important to stop the machine whenever excessive heat is generated.
Step 3
Effective cutting occurs when the working pressure goes down. You can visualise the pressure drop on the display and it is important to generate tension in the magazine. For this, you need to turn the reduction pressure block knob in the clockwise direction. The machine indicator displays the magazine output tension and during full tension it is important to stop the machine and wind the wire around a new set of wheels. Now you can continue the cutting process as described above.
Wire saw cleaning
Once cutting is over, it is time to clean the wire saw. Clean up all the related equipment and the best way to do this will be to remove the hose from its pivot and then use this water source for cleaning. Cleaning brushes can also be used for doing this effectively. Washers working with high pressure are not appropriate for such processes.
Maintenance
Daily maintenance can keep your wire saw working effectively for a long time. You need to consider regular cleaning with lubrication and servicing. Ideally, you should use professional services after 50 hours of operation.
Cleaning Area and Efficiency of Diamond Wire Online Cleaning System
Such cleaning is not very efficient, especially in multi-wire machines, as the dirt left has been known to damage the organs of the machine, which negatively influences the regularity and precision of its functioning. Therefore, the existing technology can be substantially optimized in terms of the possibility of overcoming the well-known functional limits of diamond wires in block- cutting machines for artificial and natural stone. Thus, the technological problem that forms the basis of the present invention is to achieve the best working conditions for diamond wires and in particular for the inserts in the cutting groove.
There is the problem of maintaining optimal cleanliness of the wire with the diamond inserts for the execution of cutting, even when a large quantity of swarf is created by increased advancing speed of the diamond wire which cuts into the stone block. A further aspect related to the above technological problem is that of achieving an efficient system of water supply that is economical to run and not damaging to the environment in order to remove the swarf from the diamond wire.
This technological problem is resolved, by a diamond wire machine for cutting natural or artificial stone, comprising: water distribution system for cooling within the cut made by the diamond wire in the stone; at least one closed loop diamond wire which, following a closed line of movement, repeats the cut during its movement deeper in to the stone; rotating organs for the support, motorization and tension of the diamond wire; characterized in that which presents a further cleaning system for the diamond wire with at least one washing area immediately after the cut and before, during the run of the wire, in relation to the first organ of support and motorization of the said wire, which the wire comes into contact with after the cut; the cleaning system comprising a filtration and pump assembly for the recirculation of water that supplies the washing area at high pressure. More advantageous form of construction multiple closed loop diamond wires simultaneously cut a block of stone. In a further, optimized form of construction, in addition to the first washing area there is at least a second washing area on the line of movement of the diamond wire connected to it and positioned at the same interval as the first washing area.
Preferred variant of the form of construction, there are at least three washing areas, of which one is positioned on the first organ of support and motorization of the said wire. Furthermore, in a specific form of construction, there are at least three washing areas, of which at least two are positioned near to each other after the cut and before the first organ of support and motorization of the said wire. In addition, in a further, optimized form of construction, the washing areas are at least four of which at least two are positioned near to each other after the cut and before the first organ of support and motorization of the said wire and the fourth is positioned on the first organ of support and motorization of the said wire. In a specific form of construction, the washing areas comprise a transversal tube equipped with nozzles with an elliptic jet, having larger dimension than the jet placed in the direction of the diamond wire and aligned with it.
In addition, in a further form of construction, the washing areas comprise a transversal tube equipped with nozzles aligned on staggered lines in correspondence with the position of the contiguous diamond wires. Furthermore, in a specific form of construction, the pressure of the cleaning water is high, to result in an exit speed of between 20 and 30 m/s inclusively of the jet from its relative nozzle. Finally, in a further and preferred from of construction, the filtration and pump assembly comprises two metallic cartridge filters that work in tandem or alternately when it is necessary to perform maintenance and cleaning on one of the filters.
Our factory
Resonance Technology (Ningbo) Co. Ltd, founded in December 2019 with a registered capital of 10 million RMB, is located in the High-tech Zone Ningbo, China. The company has assembled top industry technical talents along with seasoned marketing and management professionals. Leveraging cutting-edge proprietary core technologies, it specializes in researching, developing, and selling high-performance power ultrasonic core components and related complete sets of equipment. The company's products are widely used in various industries such as new materials, fine chemicals, automotive, and new energy. Currently, the company has mastered core technologies in power ultrasonics including control algorithms, power amplification, drive matching, high-power transducer, and vibration system design. Its products have reached international leading levels, with over 40 patent applications and 23 patents granted. We have obtained the GB/T19001-2016/ISO9001:2015 quality management system certification. With around 2000 square meters of research and production facilities, the company possesses a well-equipped testing center capable of conducting more than 120 types of tests in six categories including physical performance, mechanical performance, environmental testing, simulation testing, chemical testing, and precision measurement.
FAQ
As one of the leading diamond wire online cleaning system manufacturers and suppliers in China, we warmly welcome you to buy diamond wire online cleaning system for sale here from our factory. All customized products are with high quality and competitive price.
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